Challenges of ESD RF protections in advanced CMOS technologies
Thursday 8 décember 2011 from 1pm to 2pm
Amphithéâtre PHELMA, Bât. INP, MINATEC
as part of the IMEP-LAHCseminars
Abstract:
The main purpose of this presentation is to discuss the
challenge of RF ESD protections for the Advanced CMOS technologies.
Today, it is well known that the ElectroStatic Discharge (ESD)
protection is already a major challenge. This is due to the complexity
of the technologies (High K metal Gate, sub-nanometric size, dual
oxide…) and due to the complexity of System On Chip (SOC) (Mono-multi
dice, multi powers, multi applications, multi balls …). After a short
introduction on the technology Roadmap and SOC complexity, the ESD
constraints are introduced. At this step, the main accent will be done
on the integration context challenge. Afterwards, the focus will be on
RF constraints coupled with ESD protections. Some approaches, results
and silicon implementations are presented and evaluated.
Biography:
Philippe Galy is Senior Expert in micro-nano
electronics at STMicrolectronics R&D Crolles France since 2005. He
manages 4 groups in the Advanced Device Design & ESD Solutions
(ADDES) team. Before, he was professor in engineer school during 10
years old. He has authored or co-authored more than 75 publications, 2
books and 20 patents. He holds a Ph.D. and H.D.R. (academic research
supervisor).





